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portada 3D Microelectronic Packaging: From Architectures to Applications (in English)
Type
Physical Book
Illustrated by
Publisher
Author
Language
English
Pages
622
Format
Hardcover
Dimensions
23.4 x 15.6 x 3.5 cm
Weight
1.07 kg.
ISBN13
9789811570896
Edition No.
0002
Categories

3D Microelectronic Packaging: From Architectures to Applications (in English)

Yan Li (Illustrated by) · Deepak Goyal (Illustrated by) · Springer · Hardcover

3D Microelectronic Packaging: From Architectures to Applications (in English) - Li, Yan ; Goyal, Deepak

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Synopsis "3D Microelectronic Packaging: From Architectures to Applications (in English)"

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

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