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Area Array Package Design (in English)
Ken Gilleo (Author)
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Mcgraw-Hill
· Paperback
Area Array Package Design (in English) - Ken Gilleo
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Synopsis "Area Array Package Design (in English)"
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.
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