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portada integrated modeling of chemical mechanical planarization for sub-micron ic fabrication:: from particle scale to feature, die and wafer scales (in English)
Type
Physical Book
Publisher
Year
2004
Language
English
Pages
336
ISBN
354022369x
ISBN13
9783540223696

integrated modeling of chemical mechanical planarization for sub-micron ic fabrication:: from particle scale to feature, die and wafer scales (in English)

Luo, Jianfeng (Author) · springer · Physical Book

integrated modeling of chemical mechanical planarization for sub-micron ic fabrication:: from particle scale to feature, die and wafer scales (in English) - luo, jianfeng

Physical Book

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