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Print Proceedings of the Interpack International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (Ipack2019) (in English)
Asme (Author)
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American Society Of Mechanical Engineers
· Paperback
Print Proceedings of the Interpack International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (Ipack2019) (in English) - Asme
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Synopsis "Print Proceedings of the Interpack International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (Ipack2019) (in English)"
Printed collection of 90 full-length, peer-reviewed technical papers. Topics include:Autonomous, Hybrid, and Electric VehiclesEnergy Conversion and StorageFlexible and Wearable ElectronicsHeterogeneous IntegrationInternet of ThingsPhotonics and OpticsPower ElectronicsServers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions andService to ASME InterPACK, the Electronic and Photonic Packaging Division, and Leadership in Liquid Coolingof Server Systems
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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.
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