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portada Copper Electrodeposition for Nanofabrication of Electronics Devices (in English)
Type
Physical Book
Publisher
Language
English
Pages
282
Format
Hardcover
Dimensions
23.4 x 15.6 x 1.8 cm
Weight
0.59 kg.
ISBN13
9781461491750
Edition No.
2014th

Copper Electrodeposition for Nanofabrication of Electronics Devices (in English)

Kondo, Kazuo ; Akolkar, Rohan N. ; Barkey, Dale P. (Author) · Springer · Hardcover

Copper Electrodeposition for Nanofabrication of Electronics Devices (in English) - Kondo, Kazuo ; Akolkar, Rohan N. ; Barkey, Dale P.

Physical Book

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Synopsis "Copper Electrodeposition for Nanofabrication of Electronics Devices (in English)"

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: - ULSI wiring material based upon copper nanowiring - Printed circuit boards - Stacked semiconductors - Through Silicon Via - Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Hardcover.

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