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portada Design of 3D Integrated Circuits and Systems (in English)
Type
Physical Book
Publisher
Language
English
Pages
324
Format
Hardcover
Dimensions
23.1 x 15.7 x 2.5 cm
Weight
0.58 kg.
ISBN13
9781466589407
Edition No.
1

Design of 3D Integrated Circuits and Systems (in English)

Sharma, Rohit (Author) · CRC Press · Hardcover

Design of 3D Integrated Circuits and Systems (in English) - Sharma, Rohit

Physical Book

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Origin: United Kingdom (Import costs included in the price)
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Synopsis "Design of 3D Integrated Circuits and Systems (in English)"

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal-oxide-semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Hardcover.

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