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Electrical Design of Through Silicon Via (in English)
Lee, Manho ; Pak, Jun So ; Kim, Joungho (Author)
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Springer
· Paperback
Electrical Design of Through Silicon Via (in English) - Lee, Manho ; Pak, Jun So ; Kim, Joungho
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Synopsis "Electrical Design of Through Silicon Via (in English)"
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.
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