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portada Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials) (in English)
Type
Physical Book
Publisher
Author
Year
2019
Language
English
Pages
434
Format
Paperback
ISBN13
9780081025321
Edition No.
1
Categories

Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials) (in English)

Hengyun Zhang; Faxing Che; Tingyu Lin; Wensheng Zhao (Author) · Woodhead Publishing · Paperback

Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials) (in English) - Hengyun Zhang; Faxing Che; Tingyu Lin; Wensheng Zhao

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Synopsis "Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials) (in English)"

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

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