Share
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging (in English)
Xing-Chang Wei
(Author)
·
CRC Press
· Hardcover
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging (in English) - Wei, Xing-Chang
$ 184.81
$ 308.02
You save: $ 123.21
Choose the list to add your product or create one New List
✓ Product added successfully to the Wishlist.
Go to My Wishlists
Origin: United Kingdom
(Import costs included in the price)
It will be shipped from our warehouse between
Thursday, July 04 and
Tuesday, July 16.
You will receive it anywhere in United States between 1 and 3 business days after shipment.
Synopsis "Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging (in English)"
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
- 0% (0)
- 0% (0)
- 0% (0)
- 0% (0)
- 0% (0)
All books in our catalog are Original.
The book is written in English.
The binding of this edition is Hardcover.
✓ Producto agregado correctamente al carro, Ir a Pagar.
