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portada Recent Technological Advances in Financial Market Infrastructure in Asean+3: Cross-Border Settlement Infrastructure Forum (in English)
Type
Physical Book
Language
English
Pages
104
Format
Paperback
Dimensions
27.9 x 21.6 x 0.7 cm
Weight
0.34 kg.
ISBN13
9789292695736

Recent Technological Advances in Financial Market Infrastructure in Asean+3: Cross-Border Settlement Infrastructure Forum (in English)

Asian Development Bank (Author) · Asian Development Bank · Paperback

Recent Technological Advances in Financial Market Infrastructure in Asean+3: Cross-Border Settlement Infrastructure Forum (in English) - Asian Development Bank

Physical Book

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Synopsis "Recent Technological Advances in Financial Market Infrastructure in Asean+3: Cross-Border Settlement Infrastructure Forum (in English)"

This report identifies and examines six key technologies that are transforming fundamental financial market infrastructure and will serve as a springboard for the technological advancement of financial market infrastructure in the region. This report ascertains the most current status of technology adoption by Cross-Border Settlement Infrastructure Forum member organizations. They include central securities depositories and central banks in the Association of Southeast Asian Nations (ASEAN) plus the People's Republic of China, Japan, and the Republic of Korea (collectively known as ASEAN+3) region.

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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.

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