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Rf and Microwave Microelectronics Packaging (in English)
Ken (Edt) Kuang (Author)
·
Springer
· Hardcover
Rf and Microwave Microelectronics Packaging (in English) - ken (edt) kuang
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Synopsis "Rf and Microwave Microelectronics Packaging (in English)"
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Hardcover.
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