Share
Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging (in English)
Manos M. Tentzeris
(Author)
·
Jong-Hoon Lee
(Author)
·
Springer
· Paperback
Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging (in English) - Lee, Jong-Hoon ; Tentzeris, Manos M.
$ 35.99
$ 37.99
You save: $ 2.00
Choose the list to add your product or create one New List
✓ Product added successfully to the Wishlist.
Go to My WishlistsIt will be shipped from our warehouse between
Friday, May 31 and
Monday, June 03.
You will receive it anywhere in United States between 1 and 3 business days after shipment.
Synopsis "Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging (in English)"
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References
- 0% (0)
- 0% (0)
- 0% (0)
- 0% (0)
- 0% (0)
All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.
✓ Producto agregado correctamente al carro, Ir a Pagar.
