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wafer bonding: applications and technology (in English)
Marin Alexe
(Illustrated by)
·
Ulrich Gösele
(Illustrated by)
·
Springer
· Paperback
wafer bonding: applications and technology (in English) - Alexe, Marin ; Gösele, Ulrich
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Synopsis "wafer bonding: applications and technology (in English)"
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.
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